Energy-efficient, co-designed and co-integrated electronic-photonic integrated circuits and systems over high-bandwidth interconnects for high-performance computing - Anirban Samanta
From Philip Young
Abstract: To scale high-performance computing and datacom system performance in beyond-Moore technologies, critical performance limitations of power efficiency and bandwidth must be resolved. Silicon Photonics coupled with advanced packaging technologies such as 2.5D and 3D integration of electronics and photonics has emerged as an attractive field of development. This presentation introduces our current research efforts in heterogeneous integration of electronic-photonic systems over novel interconnect solutions to achieve high-bandwidth (>1 Tb/s) datalinks along with high energy efficiency (< 0.5 pJ/b). We also present our ongoing work with outside foundries and our own fabrication advancements to achieve high-performance integrated electronic-photonic systems.